JTEKT Toyoda Americas recently demonstrated a new double-disc horizontal grinder – calling it “an industry first” – that simultaneously grinds both sides of silicon wafers to +/- 1 micron from ...
Optionally interpolating the X and C axes makes it possible to use the cylindrical grinding machine for non-round shapes, for example polygons, free contours, and eccentric forms. The rotary encoder ...
Hosokawa Micron has announced the development of a high-performance cooling type mechanical mill, the Micron Glacis GC fine-grinding mill. Suitable for fine grinding of heat-sensitive products, the ...
WUHAN, HUBEI, CHINA, October 9, 2025 /EINPresswire.com/ -- In an era where railway safety and efficiency demand unprecedented precision, how does the industry achieve ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results
Feedback