We know Apple makes some of the prettiest packaging you’ll ever find wrapped around electronics, but it’s really just trash when you’re done with it. Samsung has found a terrific way to make its ...

Samsung Electronics (OTCPK:SSNLF) is planning to reorganize its supply chain for advanced semiconductor packaging, South Korean media outlet ETNews reported on Thursday, citing industry sources. The ...

In a new report from Business Korea, we're hearing that Samsung is making "significant strides" in the semiconductor packaging industry, "positioning itself ahead of TSMC in the Panel Level Packaging ...

Samsung Electronics has launched a comprehensive overhaul of its advanced packaging supply chain, focusing on "reassessing" materials, components, and equipment to boost competitiveness. This shift, ...

Samsung claims to have eliminated single-use plastics from its mobile packaging in favour of paper-based and recycled alternatives, meeting its sustainability commitment for 2025.

The company held its Samsung Foundry Forum 2024 in San Jose, California, and teased its new 3D packaging technology for HBM chips in a public event, with current-gen HBM memory chips packaged mostly ...

Samsung Electronics is reportedly investing JPY25 billion (approx. US$170 million) to set up an advanced packaging research institute in Yokohama and acquire a major office tower in the city's Minato ...

The post Samsung's 2030 Sustainability Roadmap Goes Way Beyond Recycled Packaging appeared first on Android Headlines.

Samsung is considering using Intel’s packaging and glass substrate technology to give its production line a boost. The tie-up between the firms might elevate their game and could finally outperform ...

Samsung plans to introduce its innovative SAINT 3D packaging services by 2025. This move aims to prepare for the next generation of high bandwidth memory, HBM4, expected to debut by 2026. Samsung’s ...

Samsung Electronics (OTC:SSNLF) earmarked 25 billion yen ($170 million) to establish an advanced chip packaging R&D center in Yokohama, Japan, intensifying its competition with Taiwan Semiconductor ...

Samsung Electronics’ VP for advanced packaging technology has left the company. While local media reported that Lin Jun-Cheng had resigned from his position, posting on LinkedIn he stated that he was ...