MSN on MSN

True 3D chip stacking could pack far more computing into the same footprint

A coalition of researchers from Stanford, Carnegie Mellon, the University of Pennsylvania, and MIT has demonstrated ...
Morning Overview on MSN

Researchers just crammed more computing into the same chip space by stacking silicon circuits in multiple layers — a vertical stack that squeezes whole generations …

For decades, chipmakers squeezed more transistors onto processors by shrinking them sideways. That playbook is running out of ...
NextBigFuture

Breakthrough Pseudo CMOS Transistors for 1000 Times More Efficient Computing

As transistors are scaled to smaller dimensions, their static power increases. Combining two-dimensional (2D) channel materials with complementary metal–oxide–semiconductor (CMOS) logic architectures ...
EDN

Specialty CMOS process enables high levels of integration for analog and RF products

Newport Beach, CA—Jazz Semiconductor announced the availability of a 17-GHz vertical PNP (VPNP) module on its 0.18um RFCMOS platform. The addition of the VPNP module to its RFCMOS platform enables the ...
NextBigFuture

BREAKTHROUGH CMOS N-Type Diamond Transistors

Diamond CMOS needs symmetrical doping control like we have for semiconductor silicon and diamond n-MOS is needed. The n-channel diamond MOSFETs are demonstrated. This work will enable the development ...
Nanowerk

CMOS Technology Explained

Complementary Metal-Oxide-Semiconductor (CMOS) technology is a vital part of modern electronics, used in designing and manufacturing integrated circuits (ICs) that power many digital devices. CMOS ...