New TPU; TSMC revenue, export investigation; global semi equipment sales; 2D materials roadmap; acquisitions; UALink spec; EU ...

Nevertheless, some of the biggest technological and business-related barriers are being addressed. And while a chiplet-based ...

Boot-up and software deployment in distributed, synchronized multi-processor systems that integrate additional accelerators.

Multi-die assemblies offer more flexibility, but figuring out the right amount of customization can have a big impact on ...

The AI Readiness Index Report provides a valuable benchmark against which organizations can measure their AI maturity. For ...

PCIe 6, released in January 2022, introduced a data transfer rate of 64 GT/s (gigatransfers per second), double that of its ...

Activation functions play a critical role in AI inference, helping to ferret out nonlinear behaviors in AI models. This makes ...

IC ecosystem; UPF 4.0; AI readiness; auto, industrial chiplet SW; PCIe 6; 3D thermal analysis; rad-hard simulation.

The impact of embedded micro-bumps and wafer-to-wafer hybrid bonding on the thermal behavior of the package stack.

Hardware IP Protection through Low-Overhead Fine-Grain Redaction” was published by researchers at University of Florida.

A new technical paper titled “The 2D Materials Roadmap” was published by researchers at many institutions including Chinese ...

Key applications for GenAI and the features they enable, as well as an examination of how model growth and differing model ...