Abstract: In multi-chip IGBT power modules, package-level failures typically manifest first as localized distortions in the copper baseplate temperature field before evolving into catastrophic faults.

Automatically configure the maven dependencies and repositories needed to develop allay plugins. Automatically generate the plugin descriptor (plugin.json) based on the project's metadata. Use the ...

Abstract: To address dynamic current sharing and thermal dissipation bottlenecks in multi-parallel silicon carbide (SiC) power module systems, this paper proposes a symmetrically arranged double-sided ...

The big picture: The Secure Boot certificates Microsoft originally issued in 2011 for Windows devices are set to expire next month. The company is currently rolling out new Secure Boot keys to ...