Narrowly defined verticals offer the best opportunities for AI. Plus, what will the impact be on junior engineers?

A new technical paper titled “Ultra Ethernet’s Design Principles and Architectural Innovations” was published by researchers ...

Time-of-flight sensors; manufacturing quantum chips; collaboration for growth; wafer shipment conundrum; sparse linear ...

A new technical paper titled “Physical Design Exploration of a Wire-Friendly Domain-Specific Processor for Angstrom-Era Nodes ...

A new technical paper titled “Architecting Long-Context LLM Acceleration with Packing-Prefetch Scheduler and Ultra-Large ...

Book: Using predictive analytics and heterogeneous package workflows to design cost-effective multi-die assemblies.

Researchers from the Massachusetts Institute of Technology (MIT) and Bridgewater State University developed a new way to ...

Diversity of compute elements proliferates for inference, but the mix varies by application. With AI changing so fast, it’s a ...

A new technical paper titled “Silent Data Corruption by 10x Test Escapes Threatens Reliable Computing” was published by ...

Accuracy Trade-Offs in Massive MIMO Signal Detection Using SRAM-Based In-Memory Computing” was published by researchers at ...

This article examines the system-level challenges in enabling seamless 1.6 Tbps port-level interoperability for ...

Programmable chip-to-chip photonic fabrics in multi-accelerator servers for ML” was published by researchers at Cornell ...